Rogers PCB

Rogers 4350B

The Rogers 4350B has a low loss capability and stable control on its dielectric constant (DK) — which makes its materials ideal for high power RF designs and super-active appliances.

Rogers 4003

The Rogers 4003 model uses 1674 and 1080 glass fabric styles. All its configurations have the same specifications; they don’t support bromination.

Rogers 4835

This 4835 laminate is a low-loss material that provides high stability at significant oxidation resistance and increased temperatures. With it, you’ll get standard glass or epoxy FR-4 processes and cheap circuit production.

Rogers 4360G2

This laminate offers a perfect balance of processing capability and performance. Plus, the low-loss laminate consists of hydrocarbon ceramic-filled thermostat materials.

Rogers 3003

This Rogers PCB model is suitable for automotive radar applications with 77 GHz and it also supports 5G wireless applications and ADAS.

Rogers 3006

The 3006 model offers excellent mechanical and electrical stability—with a reliable dielectric constant across various temperatures. And it removes the step change in the Dk.

Rogers 3010

The 3010 is one of the most affordable models with advanced ceramic-filled PTFE materials. Hence, its stability streamlines the broadband components.

Rogers 0588

Reinforced with glass microfibers, the Rogers 5880 has a low DK and loss feature. Hence, it makes the model highly suitable for broadband and high-frequency applications.

Rogers 6002

The 6002 model comes with low DK materials that are ideal for sophisticated microwave structures. Hence, it's ideal for multi-layer board designs.

Rogers 6010

This RO6010 is ideal for microwave and electronic board applications that require a high DK. Also, the model is ideal—if you plan on dealing with circuit size reduction.

Property

RO4350B

RO3003

RO3006

RO3010

RO4835

RO5880

RO6002

RO6010

RO4003

RO 4360G2

Dk, Process

(2)3.48
± 0.05

3.00
± 0.04

6.15
± 0.15

10.2
± 0.30

3.48
± 0.05

2.20
± 0.02

2.94
± 0.04

10.2
± 0.25

3.38
± 0.05

6.15
± 0.15

Dk Design

3.66

3.00

6.50

11.20

3.66

2.20

2.94

-

3.55

-

Dissipation Factor

0.0037
0.0031

0.001
0

0.002
0

0.002
2

0.003
7

0.0004
0.0009

0.001
2

0.002
3

0.0027
0.0021

0.003
8

Thermal Coefficient

+50

-3

-262

-395

+50

-125

+12

-425

+40

-

Dimension Stability

-

-0.06
0.07

-0.27
-0.15

-0.35
-0.31

-

-

-

-

-

-

Volume Resistivity

1.2 X 10^10

10^7

10^5

10^5

5 x 10^8

2 x 10^7

10^6

5 x 10^5

1.7 X 10^10

4.0 x 10^13

Surface Resistivity

5.7 X 10^9

10^7

10^5

10^5

7 x 10^8

3 x 10^7

10^7

5 x 10^6

4.2 X 10^9

9.0 x 10^12

Electrical Strength

31.2
(780)

-

-

-

30.2
(755)

0.96
(0.23)

-

-

31.2
(780)

784

Tensile Modulus

16,767 (2,432)
14,153, (2,053)

930
823

1498
1293

1902
1934

7780
(1128)

1070 (156) 450 (65), 860 (125) 380 (55)

828 (120)

931 (135)

19,650 (2,850) 19,450 (2,821)

-

Property

RO4350B

RO3003

RO3006

RO3010

RO4835

RO5880

RO6002

RO6010

RO4003

RO 4360G2

Tensile Strength

203 (29.5)
130 (18.9)

-

-

-

136 (19.7)

-

-

17 (2.4)

139 (20.2)
100 (14.5)

131 (19)
97 (14)

Flexural Strength

255 (37)

-

-

-

186 (27)

-

-

4364 (633)

276 (40)

213 (31)
145 (21)

Dimensional Stability

<0.5

-

-

-

<0.5

-

-

-

<0.3

-

Coefficient of Thermal Expansion

10
12
32

17
16
25

17
17
24

13
11
16

10
12
32

31
48
237

16
16
24

24
24
24

11
14
46

13
14
28

Tg

>280

-

-

-

>280

-

-

-

>280

>280

Td

390

500

500

500

390

500

500

500

425

407

Specific Heat

-

0.9

0.86

0.8

-

-

0.93 (0.22)

1.00 (0.239)

-

-

Thermal Conductivity

0.69

0.50

0.79

0.95

0.66

0.22

0.60

0.78

0.71

0.75

Moisture Absorption

0.06

0.04

0.02

0.05

0.05

0.02

0.02

0.05

0.06

0.08

Density

1.86

2.1

2.6

2.8

1.92

2.2

2.1

3.1

1.79

2.16

Copper Peel Strength

0.88 (5.0)

12.7

7.1

9.4

0.88 (5.0)

31.2 (5.5)

8.9 (1.6)

12.3 (2.1)

1.05 (6.0)

5.2 (0.91)

Flammability

(3)V-0

V-0

V-0

V-0

V-0

V-0

V-0

94V-0

N/A

V-0

Lead-Free Process Compatible

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

-

Factors

Rogers Material

FR-4 Material

Dissipation factor (DF)

0.004

0.020

Price

Expensive

Affordable

Thermal Management

The Rogers material manages high temperatures perfectly.

This grade material doesn’t handle high temperature well.

Performance

Remarkable

Decent

Dielectric Constant (DK)

6.15 to 11

4.5

Impedance Stability

Higher polarity and stabilizes charges effectively.

Lower polarity and it doesn’t stabilize charges well.

Applications

Rogers is a better option for space applications because it reduces outgassing effectively.

The FR-4 isn’t so ideal for space applications because it isn’t outgassing tolerant.